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this is information on a product in full production. august 2014 docid024843 rev 2 1/14 ECMF02-3HSM6 common mode filter with esd protection for mhl/usb2.0/usb3.0 interface datasheet - production data figure 1. pin configuration (top view) features ? provides -20 db attenuation at 700 mhz in lte bands ? high common mode attenuation: ? -25 db at 800 mhz ? -10 db at 2ghz ? very low pcb space consumption ? thin package: 0.55 mm max. ? lead-free package ? high reduction of parasitic elements through integration. complies with the following standards: ? iec 61000-4-2 level 4: ? 15 kv (air discharge) ? 8 kv (contact discharge) applications ? mobile phones ? notebook, laptop ? portable devices ? pnd description this device is a highly integrated common mode filter designed to suppress emi/rfi common mode noise on high speed differential serial buses and complies with the mhl standard.the device can protect and filter a single differential lane. qfn-6l 1.6 x 1.35 mm 1 2 3 6 5 4 d1+ d1- id d1+ d1- gnd www.st.com
characteristics ECMF02-3HSM6 2/14 docid024843 rev 2 1 characteristics figure 2. electrical characteristics (definitions) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp peak pulse voltage iec 61000-4-2 contact discharge (connector side) air discharge (connector side) 8 16 kv i dc maximum dc current 100 ma t op operating temperature range -40 to +85 c t j maximum junction temperature 125 c t stg storage temperature range - 55 to +150 c table 2. electrical characteristics (t amb = 25 c) symbol test conditions min. typ. max. unit v br i r = 1 ma 6 v i rm v rm = 3 v per line 100 na r dc dc serial resistance 5 symbol parameter v = breakdown voltage br i = leakage current @ v rm rm v = stand-off voltage rm i = breakdown current r i v i rm i r v rm v br
docid024843 rev 2 3/14 ECMF02-3HSM6 characteristics 14 figure 3. differential attenuation versus frequency (z 0 diff = 100 ) figure 4. common mode attenuation versus frequency (z 0 com = 50 ) sdd21 (db) 10m 30m 100m 300m 1g 3g -5 -4 -3 -2 -1 0 f (hz) scc21 (db) 10m 30m 100m 300m 1g 3g -40 -35 -30 -25 -20 -15 -10 -5 0 f (hz)
characteristics ECMF02-3HSM6 4/14 docid024843 rev 2 figure 5. return loss versus frequency (z 0 com = 50 ) figure 6. differential (z dd21 ) and common mode (z cc21 ) impedance versus frequency 10m 30m 100m 300m 1g 3g -40 -35 -30 -25 -20 -15 -10 -5 0 sdd11 sdd22 f (hz) sddxx (db) 1e7 1e8 1e9 6e9 1e1 1e2 1e3 1e4 z dd21 z cc21 () f (hz)
docid024843 rev 2 5/14 ECMF02-3HSM6 characteristics 14 figure 7. esd response to iec61000-4-2 (+8 kv contact discharge) on data lane figure 8. esd response to iec61000-4-2 (-8 kv contact discharge) on data lane 20 v/div 20 ns/div v : esd peak voltage pp v :clamping voltage @ 30 ns cl v :clamping voltage @ 60 ns cl v :clamping voltage @ 100 ns cl 1 2 3 4 71.2 v 27.7 v 19.6 v 14.3 v 1 2 4 3 20 v/div -71.7 v -15.8 v -13.6 v -3.1 v 20 ns/div 1 2 4 v : esd peak voltage pp v :clamping voltage @ 30 ns cl v :clamping voltage @ 60 ns cl v :clamping voltage @ 100 ns cl 1 2 3 4 3
characteristics ECMF02-3HSM6 6/14 docid024843 rev 2 figure 9. esd response to iec61000-4-2 (+8 kv contact discharge) on id pin figure 10. esd response to iec61000-4-2 (-8 kv contact discharge) on id pin 20 v/div 20 ns/div v : esd peak voltage pp v :clamping voltage @ 30 ns cl v :clamping voltage @ 60 ns cl v :clamping voltage @ 100 ns cl 1 2 3 4 136.8 v 27.6 v 23.7 v 15.3 v 1 2 4 3 20 v/div -112.5 v -17.5 v -12 v -3.7 v 20 ns/div 1 2 4 v : esd peak voltage pp v :clamping voltage @ 30 ns cl v :clamping voltage @ 60 ns cl v :clamping voltage @ 100 ns cl 1 2 3 4 3
docid024843 rev 2 7/14 ECMF02-3HSM6 characteristics 14 figure 11. usb2.0 480 mbps eye diagram without device figure 12. usb2.0 480 mbps eye diagram with device thru ECMF02-3HSM6 figure 13. usb3.0 5 gbps eye diagram without device figure 14. usb3.0 5 gbps eye diagram with device thru 250 mv/c 33.4 ps/c 250 mv/c 33.4 ps/c ECMF02-3HSM6 figure 15. mhl 2.25 mbps eye diagram without device figure 16. mhl 2.25 mbps eye diagram with device thru ECMF02-3HSM6
characteristics ECMF02-3HSM6 8/14 docid024843 rev 2 figure 17. tdr before compensation mhl template after compensation z (ohm) time (ns) 120 110 100 90 80 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
docid024843 rev 2 9/14 ECMF02-3HSM6 application information 14 2 application information figure 18. usb and mhl schematic more application information available in following an: ? application note an4356: "antenna desense on handheld equipment" ? application note an4511: "common mode filters" ? application note an4540: "mhl link filtering and protection" usb connector usb controller ECMF02-3HSM6 d+ d- id d+ d- id gnd
pcb layout recommendations ECMF02-3HSM6 10/14 docid024843 rev 2 3 pcb layout recommendations figure 19. pcb layout recommendations figure 20. pcb stack dimensions 4000 m 300 m 300 m 200 m 100 m 100 m 400 m 4000 m connector host 40 m 105 m r = 4.28
docid024843 rev 2 11/14 ECMF02-3HSM6 package information 14 4 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 21. qfn-6l di mension definitions table 3. qfn-6l dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.45 0.50 0.55 0.018 0.020 0.022 a1 0.00 0.02 0.05 0.00 0.0008 0.002 b 0.15 0.20 0.25 0.006 0.008 0.010 d 1.55 1.60 1.65 0.061 0.063 0.065 e 1.30 1.35 1.40 0.051 0.053 0.055 e 0.45 0.50 0.55 0.018 0.020 0.022 l 0.40 0.50 0.60 0.016 0.020 0.024 d index area top view side view bottom view e a e l b a1 pin # 1 id 1 6 3 4
package information ECMF02-3HSM6 12/14 docid024843 rev 2 note: product marking may be rotated by multiples of 90 for assembly plant differentiation. in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. figure 24. tape and reel specifications figure 22. footprint figure 23. marking 0.20 0.50 0. 0 7 1.75 1.20 km dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 4.0 2.0 8.0 1.75 3.5 ? 1.55 0.75 1.60 0.22 1.90
docid024843 rev 2 13/14 ECMF02-3HSM6 ordering information 14 5 ordering information figure 25. ordering information scheme 6 revision history table 4. ordering information order code marking (1) 1. the marking can be rotated by multiples of 90 to differentiate assembly location package weight base qty delivery mode ECMF02-3HSM6 km qfn-6l 3.03 mg 3000 tape and reel ecmf 02 - 3 hs m6 function common mode filter with esd protection number of lines 02 = 2 filtered lines number of esd protected lines 3 lines with esd protection version hs = high speed package m6 = qfn-6l table 5. document revision history date revision changes 02-oct-2013 1 initial release. 25-aug-2014 2 added figure 6: differential (zdd21) and common mode (zcc21) impedance versus frequency .
ECMF02-3HSM6 14/14 docid024843 rev 2 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2014 stmicroelectronics ? all rights reserved

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